3D simulation effect analysis simulator for MOSFETs
Analysis tool for 3D simulation effects in MOSFETs.
In STI (shallow trench isolation) confined MOS, the SiO2/Si interface separation causes dopant diffusion in the width direction. For HV (high voltage) MOSFETs, 3D diffusion and narrow gate side fields shift the threshold voltage Vth downward as if reducing the width. In the typical process flow of nanoMOSFETs, reducing the width to W>0.1 um increases Vth. In square-trenched UMOS, the effects of geometry and 3D diffusion shift Vth downward as if reducing the square size.
- Company:クロスライトソフトウェアインク日本支社
- Price:Other